Printed circuit boards, otherwise known as PCB are found in almost all electronic devices. In manufacturing of PCB, electricians who are amateurs can make their own boards by drawing a design and then giving it to the manufacturer. There are three types; single sided, multi layered and double side boards. They are usually conducted with nickel, copper or aluminum material, and the type used is determined by the complexity and density of the circuits. The process of making them is described below.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
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